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Brand Name : Bicheng Enterprise Limited
Model Number : BIC-0808-V8.08
Certification : UL
Place of Origin : China
MOQ : 1
Price : USD69~110
Payment Terms : T/T/Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 2-3 working days
Packaging Details : KK carton (hard card)
Base material : Stainless steel shim
Foil Thickness(Optional) : 0.12mm
Aperture configured : Laser cut
Appearance : Engraving and electro polishing
Fiducial mark : Through hole
Application : CSP, BGA, 0.5mm QFP etc. package
Product profile
1.1 General description
 This is a type of laser cut SMT stencil built on 0.12mm stainless steel foil with 
420 mm x 520 mm x 20mm dimension. It’s fabricated per IPC 7525A using
supplied Gerber data, squeegee area locating in the center. 4 sides of fiducal
marks are through holes to suit for the SMT machine. It’s packed with KK carton
(hard card) and usually 2 stencils are packed for shipment.
1.2 Features and benifits
 A. The data file is used directly to produce and reduce the error rate;
 B. The opening position accuracy of SMT template is very high: the whole process 
     error is ≤ ±4 μ m;
 C. The opening of SMT template has geometric figure, which is advantageous to 
      the printing and forming of tin paste;
 D. ISO9000 certified manufacturing factory;
 E. 12 hours quotation;
 F.  Quick Lead time: 1-2 days;
 G. No MOQ, low cost for prototypes and small runs quantity;
1.3 Application
 SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip
1.4 Parameter and data sheet
| Dimension: | 520 x 420 mm =1 PCS | |||||
| Structure | Stencil foils with aluminum frame | |||||
| Base material | Stainless steel shim | |||||
| Foil Thickness | 0.12mm | |||||
| Aperture configured | Laser cut | |||||
| Appearance | Engraving and electro polishing | |||||
| Fiducial mark | Through hole | |||||
| Service area: | Worldwide | |||||
| Quantity of open pads: | 761 | |||||
| Advantages: | a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. | |||||
| Application: | CSP, BGA, 0.5mm QFP etc. package | |||||
1.5 Opening Hole Design for Stencil
| Component Type | Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness | 
| PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm | 
| QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm | 
| QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm | 
| QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm | 
| QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm | 
| 0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
| 0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
| BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
| BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
| BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
| Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm | 
| Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm | 


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